VLSI TECHNOLOGY

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VLSI TECHNOLOGY

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Wafer Lapping
After the sawing processing the wafer edges are ground in a mechanical process to round the sharp edges created through the slicing process.
The round edges prevent chipping of the wafers in later processes.
After edge rounding the wafers are then rough polished to remove most of the damage caused by the wafer sawing process.
This is known as lapping and is a double sided process performed under pressure using a glycerine slurry with alumina (Al2O3) particles suspended in it.

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