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Title: Introduction to cdma2000 Standards for Spread Spectrum Systems Page Link: Introduction to cdma2000 Standards for Spread Spectrum Systems - Posted By: shefi Created at: Thursday 17th of August 2017 04:41:14 AM | |||
Introduction to cdma2000 Standards for Spread | |||
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Title: matlab code to find false acceptance rate Page Link: matlab code to find false acceptance rate - Posted By: Ann Nimmy Thomas Created at: Thursday 17th of August 2017 04:47:33 AM | |||
matlab code to find false acceptance rate | |||
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Title: carbon chip or diamond chip Page Link: carbon chip or diamond chip - Posted By: sreeku_princess Created at: Thursday 17th of August 2017 08:37:09 AM | |||
please note the seminar report and ppt of the topic added in the following pages | |||
Title: RATE DELAY GUARANTEES PROVIDED BY CLOSE PACKET SWITCHES WITH LOAD BALANCING-NETWOR Page Link: RATE DELAY GUARANTEES PROVIDED BY CLOSE PACKET SWITCHES WITH LOAD BALANCING-NETWOR - Posted By: whtnxt Created at: Thursday 17th of August 2017 04:42:11 AM | |||
RATE & DELAY GUARANTEES PROVIDED BY CLOSE PACKET SWITCHES WITH LOAD BALANCING-NETWORKING | |||
Title: diamond chip o carbon chip Page Link: diamond chip o carbon chip - Posted By: thasnima.s Created at: Thursday 17th of August 2017 06:11:37 AM | |||
Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc | |||
Title: CDMA2000 Page Link: CDMA2000 - Posted By: chitra Created at: Thursday 17th of August 2017 06:55:25 AM | |||
CDMA2000 is a technology for the development of cdmaOne/IS-95 to 3rd generation services. Also known as IMT-CDMA Multi-Carrier or IS-2000 is the main route for CDMA operators to second-and-a-half ( 2.5G) and third generation (3G) cellular networks. A set of new standards that define the new air interface and the Radio Access and Core Network changes that will enhance network capacity, improve speed and bandwidth to mobile terminals, and allow end-to-end IP services has been created by the standard-setting body behind CDMA2000 known as 3GPP2. CD ....etc | |||
Title: Design of Rate-Compatible RA-Type Low-Density Parity-Check Codes Using Splitting Page Link: Design of Rate-Compatible RA-Type Low-Density Parity-Check Codes Using Splitting - Posted By: NITISH Created at: Thursday 17th of August 2017 05:01:08 AM | |||
Design of Rate-Compatible RA-Type Low-Density Parity-Check Codes Using Splitting | |||
Title: GOP-Based Channel Rate Allocation Using Genetic Algorithm for Scalable VideoStreamin Page Link: GOP-Based Channel Rate Allocation Using Genetic Algorithm for Scalable VideoStreamin - Posted By: kadamvinayak Created at: Thursday 17th of August 2017 04:42:11 AM | |||
GOP-Based Channel Rate Allocation Using Genetic Algorithm for Scalable Video Streaming Over Error-Prone Networks | |||
Title: Jointly Optimal Source-Flow Transmit-Power and Sending-Rate Control for Maximum-Th Page Link: Jointly Optimal Source-Flow Transmit-Power and Sending-Rate Control for Maximum-Th - Posted By: Debasis mohany Created at: Thursday 17th of August 2017 04:48:02 AM | |||
Abstract Emerging media overlay networks for wireless applications aim at delivering Variable Bit Rate (VBR) encoded media contents to nomadic end users by exploiting the (fading-impaired and time-varying) access capacity offered by the last-hop wireless channel. In this application scenario, a still open question concerns the closed-form design of control policies that maximize the average throughput sent over the wireless last hop, under constraints on the maximum connection bandwidth available at the Application (APP) layer, the queue cap ....etc | |||
Title: Flip chip or Direct Chip Attach DCA Page Link: Flip chip or Direct Chip Attach DCA - Posted By: nwaji okorafor g. Created at: Thursday 17th of August 2017 08:34:30 AM | |||
In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc |
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