In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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pooja raju
Ppt of OPTICAL OFDM FOR HIGH SPEED WIRELESS OPTICAL COMMUNICATION
how to prepare ppt on this seminar topic? ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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A HIGH SPEED DISTRIBUTED FIFO SCHEME FOR MANAGING INTERCONNECTS

Abstract:- Interconnect delays are increasingly becoming the dominant source of performance degradation in the nano-meter regime, largely because the wires do not scale as well as the transistors. Scaling trends allow for complete systems to be built on a single chip (SoC), but they require long interconnects for global signals and clock distribution networks. The parasitic of these global interconnects make efficient and high-performance operation difficult. On-chip communicati ....etc

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Abstract
Most device drivers have one ulterior motive and one target to achieve - deliver the maximum using the minimum. No matter how stable or feature rich a device driver might be, if it cannot perform in terms of high throughput and low CPU utilization, it is as good as any other run of the mill driver.The objective of this topic is to use the thinking out of the box concept and expose techniques, which go beyond just good programming principles to get that extra edge which can put your next driver into the elite group of high perform ....etc

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INTROUCTION

The idea of using optical techniques to address the chip-to-chip interconnection problems has been around for a long time. However, it is only in the last few years that technology with a realistic promise of eventual commercial applications has emerged. Progress can be attributed to a shift away from trying to develop custom VSLI techniques with in-built optoelectronic capability, towards developing techniques to allow parallel arrays of separately fabricated optoelectronic devices to be tightly integrated with standard foundry ....etc

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Sir,
The mentioned project is about optical switching/ network in telecom back backbone(core ) and access network. Hence requesting you to guide me in design aspect , architecture, potential problem,solution and survivablity,etc for my M Tech Project

regards
Niranjan ....etc

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OPTICAL devices

INTRODUCTION
Explosive information demand in the internet world is creating enormous needs for capacity expansion in next generation telecommunication networks. It is expected that the data- oriented network traffic will double every year. Optical networks are widely regarded as the ultimate solution to the bandwidth needs of future communication systems. Optical fiber links deployed between nodes are capable to carry terabits of information but the electronic switching at the nodes limit th ....etc

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Abstract:

In this paper, analysis of CDMA network with Optical Amplifiers has been done. As the optical amplifier provides gain as well as has nonlinear characterstics, gain is expected due to signal amplification as well as operation of SOAs as limiter due to gain saturation. In this paper results have been computed for with different SOA placements in a typical star topology employing CDMA. The results show that in a star topology network employing CDMA, placement of SOAs before CDMA decoder does provide benefit due to g ....etc

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please note the seminar report and ppt of the topic added in the following pages
http://seminarsprojects.net/Thread-diamond-chip
http://seminarsprojects.net/Thread-diamond-chip?page=3
http://seminarsprojects.net/Thread-diamond-chip-o-carbon-chip

just enjoy the idea of big Diamond chip ....etc

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