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ABSTRACT
Chameleon chips are chips whose circuitry can be tailored specifically for the problem at hand. Chameleon chips would be an extension of what can already be done with field-programmable gate arrays (FPGAS). An FPGA is covered with a grid of wires. At each crossover, there's a switch that can be semipermanently opened or closed by sending it a special signal. Usually the chip must first be inserted in a little box that sends the programming signals. But now, labs in Europe, Japan, and the U.S. are developing techniq ....etc

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http://seminarsprojects.net/Thread-diamond-chip
http://seminarsprojects.net/Thread-diamond-chip?page=3
http://seminarsprojects.net/Thread-diamond-chip-o-carbon-chip

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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ABSTRACT
Chameleon chips are chips whose circuitry can be tailored specifically for the problem at hand. Chameleon chips would be an extension of what can already be done with field-programmable gate arrays (FPGAS). An FPGA is covered with a grid of wires. At each crossover, there's a switch that can be semipermanently opened or closed by sending it a special signal. Usually the chip must first be inserted in a little box that sends the programming signals. But now, labs in Europe, Japan, and the U.S. are developing techniq ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Respected Sir! send me all topics of chameleon chips
1.advantages and disadvatages
2.applications (where it is uses)
3.figures of chameleonchips
4.history
5.types
6. technoliges of chameleonchips


I'm waiting for your valuable information.

thanking u sir,

Your's Sincearly,
A.S.Hemalatha. ....etc

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