In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

[:=Read Full Message Here=:]

To get full information or details of silicon oxide nitride oxide silicon please have a look on the pages

http://seminarsprojects.net/Thread-silicon-oxide-nitride-oxide-silicon-memmory-sonos

if you again feel trouble on silicon oxide nitride oxide silicon please reply in that page and ask specific fields in silicon oxide nitride oxide silicon ....etc

[:=Read Full Message Here=:]

Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

[:=Read Full Message Here=:]

To get full information or details of photonic ic technology please have a look on the pages

http://seminarsprojects.net/Thread-silicon-photonics--31916?pid=71785&mode=threaded

if you again feel trouble on photonic ic technology please reply in that page and ask specific fields in photonic ic technology ....etc

[:=Read Full Message Here=:]

Advances in Photonic Devices


abstract

Computers have enhanced human life to a great extent. The goal of improving on computer speed has resulted in the development of the Very Large Scale Integration (VLSI) technology with smaller device dimensions and greater complexity. VLSI technology has revolutionized the electronics industry and additionally, our daily lives demand solutions to increasingly sophisticated and complex problems, which requires more speed and better performance of computers.
For these ....etc

[:=Read Full Message Here=:]

Fundamentals of Silicon Photonic Devices

B. Thomas Smith, Dazeng Feng, Hongbing Lei,
Dawei Zheng, Joan Fong, and Mehdi Asghari.
Main: 626-236-4500, email: [email protected]
Kotura, Inc., 2630 Corporate Place, Monterey Park, CA. 91754, USA


This paper offers a brief introduction to silicon photonics including the basic optical waveguide, passive
optical circuit performance, the addition of doped p- and n- junctions adjacent to the intrinsic silicon
waveguide to inject a current across the waveguide, fr ....etc

[:=Read Full Message Here=:]

A SONOS memory cell is formed from a standard polysilicon NMOS transistor with the addition of a small sliver of silicon nitride inserted inside the transistor's gate oxide. The sliver of nitride is non-conductive but contains a large number of charge trapping sites able to hold an electrostatic charge. The nitride layer is electrically isolated from the surrounding transistor, although charges stored on the nitride directly affect the conductivity of the underlying transistor channel. The oxide/nitride sandwich typically consists of a 2 nm thi ....etc

[:=Read Full Message Here=:]

Abstract

The first purely silicon oxide-based Resistive RAM memory chip that can operate in ambient conditions opening up the possibility of new super-fast memory - has been developed by researchers at UCL.Resistive RAM (or ReRAM ) memory chips are based on materials, most often oxides of metals, whose electrical resistance changes when a voltage is applied and they remember this change even when the power is turned off.ReRAM chips promise significantly greater memory storage than current technology, such as the Flash memory used on US ....etc

[:=Read Full Message Here=:]

please note the seminar report and ppt of the topic added in the following pages
http://seminarsprojects.net/Thread-diamond-chip
http://seminarsprojects.net/Thread-diamond-chip?page=3
http://seminarsprojects.net/Thread-diamond-chip-o-carbon-chip

just enjoy the idea of big Diamond chip ....etc

[:=Read Full Message Here=:]

Adaptive Photonic Phase Locked Elements Documentation ....etc

[:=Read Full Message Here=:]