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Title: ppt on the role of vlsi and sdr technology in making mobile affordable and flexible
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Title: 3d image processing vlsi system with network on chip system and reconfigurable memor
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Title: diamond chip o carbon chip
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Posted By: thasnima.s
Created at: Thursday 17th of August 2017 06:11:37 AM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: abstract for the role of vlsi sdr in making mobiles affordable flexible
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Posted By: siyerindu
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Title: estimation of age through fingerprints using wavelet transform and singular value de
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Posted By: fin
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introduction
The science of fingerprints is typically used for identification or verification of identity and for official documentation. On the basis of existing varieties and from fingerprints, we can handle your identity along with gender, age and ethnicity. Primary dermal ridges (Ridge view) are formed during
gestational week 12-19 and the configuration of fingerprint ridge (fingerprint) ever recorded. Variations in the size range and sex differences in the Ridge width has been reported. Ridges and patterns have a number of properties that ....etc

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Title: carbon chip or diamond chip
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Posted By: sreeku_princess
Created at: Thursday 17th of August 2017 08:37:09 AM
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Title: vlsi chip makings singular future
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Posted By: abhijit.dahiwalkar
Created at: Thursday 17th of August 2017 08:20:35 AM
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Title: ppt on vlsi chip makings singular future
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Posted By: ben
Created at: Thursday 05th of October 2017 04:05:26 AM
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Title: VLSI CHIP MAKINGS SINGULAR FUTURE
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Posted By: confused
Created at: Thursday 05th of October 2017 05:00:03 AM
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Prepared by:
G.Naga Sathish
D.Krishna Avinash

ABSTRACT
Since the invention of the integrated circuit in 1958,the number of processing steps required to make one has grown from less than 10 to several hundreds. At the same time, the silicon wafers on which the VLSI ICs are produced have gone from being coin sized to being dinner-plate sized. Today one of these 300-mm wafers can yield more than 700 Ics.With such a large number of Ics coming from a single wafer and with wafers coming off manufacturing li ....etc

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Title: Flip chip or Direct Chip Attach DCA
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Posted By: nwaji okorafor g.
Created at: Thursday 17th of August 2017 08:34:30 AM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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