Respected sir,
my name is akhilnath.g, i'm a bca student ,for my studies i want to do a seminar and my teacher give me the topic carbon chip. but i don't know about carbon chip. coming 30th i want to submit the seminar i need your help..
if you know more about the topic please send the details immediately or send me to a full seminar report about the topic carbon chip(diamond chip)
i expect a good response from you.
faithfully
Akhil nath.G ....etc

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please go through the following threads for more details on 'diamond or carbon chip'.

http://seminarsprojects.net/Thread-diamond-chip--13238
http://seminarsprojects.net/Thread-diamond-chip-o-carbon-chip?pid=14657#pid14657 ....etc

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please note the seminar report and ppt of the topic added in the following pages
http://seminarsprojects.net/Thread-diamond-chip
http://seminarsprojects.net/Thread-diamond-chip?page=3
http://seminarsprojects.net/Thread-diamond-chip-o-carbon-chip

just enjoy the idea of big Diamond chip ....etc

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Carbon the basis of all organic compounds appears to supplant silicon as the material of choice for future semiconductors. various structures based on the element that sits just above silicon on the Periodic Table can surpass silicon's abilities in thermal performance, frequency range and perhaps even superconductivity.diamond is probably the closest ,And Three dimensional carbon diamond offers 10 times the heat dissipation of silicon, 40 nanometer to 15micron diamond films on silicon wafers. Two-dimensional carbon--3-angstrom-thick monolayers ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Sir/Madam

kindly send me any power point paper presentation on

EFFICIENT ON CHIP CROSSTALK AVOIDANCE CODEC DESIGN based on time delay



Sir/Madam

kindly send me any power point paper presentation on

EFFICIENT ON CHIP CROSSTALK AVOIDANCE CODEC DESIGN based on time delay

to my email

[email protected] ....etc

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please note the seminar report and ppt of the topic added in the following pages
http://seminarsprojects.net/Thread-diamond-chip
http://seminarsprojects.net/Thread-diamond-chip?page=3
http://seminarsprojects.net/Thread-diamond-chip-o-carbon-chip

just enjoy the idea of big Diamond chip ....etc

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Development of the Carbon Fiber Reinforced Carbon-carbon Composite for High Temperature Gas-cooled Reactors
In the present paper. details of the development of the candidate CIC composite are described. In the material development, especially, feasibility of the production. stableness of the supply and cost are much taken into consideration. As the physical properties of the material, high mechanical strength such as tensile and bending, high fracture strain and fracture toughness and low dimensional change by neutron ir ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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please go through the following thread for more details on 'Carbon Chips'.

http://seminarsprojects.net/Thread-diamond-or-carbon-chip--8044 ....etc

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